IC Chip incoming Quality Control Procedure

 
Receipt Verification → Appearance / Marking / Packaging → Pins / Coplanarity → On-board Electrical Test → Solderability → MSD (Moisture Sensitive Device) Control → Qualified Warehousing / Unqualified Isolation

1. Receipt Verification：Check part number, brand, batch, package, quantity, order, delivery note, origin and date code. Inspect vacuum packaging, moisture barrier bag and humidity indicator card.

2. Visual & Marking Inspection：Ensure chip surface free of scratches, oxidation, discoloration and contamination. Marking must be clear, legible, without ghosting, alteration, grinding or refurbishing signs.

3. Lead / Pad & Dimensional Check：Leads free of oxidation, deformation, bending, damage or solder traces. Dimensions, lead pitch and coplanarity comply with datasheet.

4. Electrical Test：Perform on-board functional test, read/write, timing and voltage verification. Check no short-circuit or breakdown on pins.

5. Solderability Test：Simulate reflow or dip soldering; solder must wet evenly and brightly, no non-wetting or dewetting.

6. Moisture Sensitive Device (MSD) Control：Confirm MSL level, record exposure time; bake and re-pack if expired.

7. Authenticity & Documentation Check：Verify original label, anti-counterfeit features, COC/COA and customs documents (imported parts).

8. Disposition & Release：Passed parts labeled and warehoused; failed parts isolated, identified and processed for return, replacement or special approval.

9. Record Keeping：File inspection report, batch number, sample quantity, defect rate and disposition.